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(Ebook) Handbook of 3D Integration, Volume 3: 3D Process Technology by Philip Garrou; Mitsumasa Koyanagi; Peter Ramm ISBN 9783527334667, 3527334661

  • SKU: EBN-5301796
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Instant download (eBook) Handbook of 3D Integration, Volume 3: 3D Process Technology after payment.
Authors:Philip Garrou; Mitsumasa Koyanagi; Peter Ramm
Pages:474 pages.
Year:2014
Editon:3
Publisher:Wiley-VCH Verlag GmbH
Language:english
File Size:33.04 MB
Format:pdf
ISBNS:9783527334667, 3527334661
Categories: Ebooks

Product desciption

(Ebook) Handbook of 3D Integration, Volume 3: 3D Process Technology by Philip Garrou; Mitsumasa Koyanagi; Peter Ramm ISBN 9783527334667, 3527334661

Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology.Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
*Free conversion of into popular formats such as PDF, DOCX, DOC, AZW, EPUB, and MOBI after payment.

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