(Ebook) Wafer Manufacturing Shaping of Single Crystal Silicon Wafers 1st Edition by Imin Kao, Chunhui Chung ISBN 9780470061213 0470061219

(Ebook) Wafer Manufacturing Shaping of Single Crystal Silicon Wafers 1st Edition by Imin Kao, Chunhui Chung ISBN 9780470061213 0470061219

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Product details:

ISBN 10: 0470061219
ISBN 13: 9780470061213
Author: Imin Kao, Chunhui Chung

(Ebook) Wafer Manufacturing Shaping of Single Crystal Silicon Wafers 1st Edition Table of contents:

Part I: From Crystal to Prime Wafers

1 Wafers and Semiconductors

1.1 Introduction

1.2 Semiconductor Revolution

1.3 Silicon Wafers Used in Device Manufacturing (IC and MEMS)

1.4 Surface Properties and Quality Measurements of Wafers

1.5 Other Properties and Quality Requirements of Silicon Wafers

1.6 Economics of Wafer Manufacturing

1.7 Summary

References

Notes

2 Wafer Manufacturing: Generalized Processes and Flow

2.1 Introduction

2.2 Wafer Manufacturing: Generalized Process Flow

2.3 Crystal Growth

2.4 Wafer Forming

2.5 Wafer Polishing

2.6 Wafer Preparation

2.7 Industrial Processes of Wafer Manufacturing

2.8 Summary

References

Notes

3 Process Modeling and Manufacturing Processes

3.1 Introduction

3.2 Wafer Manufacturing and Brittle Materials

3.3 Ductile Machining Versus Brittle Machining

3.4 Abrasive Machining in Wafer Manufacturing

3.5 Abrasive Materials

3.6 Ductile Machining of Brittle Materials

3.7 Process Modeling of Wafer Manufacturing Processes

3.8 Abrasive Slurry in FAM Processes

3.9 Summary

References

Notes

Part II: Wafer Forming

4 Wafer Slicing Using a Modern Slurry Wiresaw and Other Saws

4.1 Introduction

4.2 The Modern Wiresaw Technology

4.3 The Three Categories of Saw for Wafer Slicing

4.4 Inner‐diameter (ID) Saw

4.5 The Modern Slurry Wiresaw

4.6 Comparison Between the ID Saw and Wiresaw

4.7 Research Issues in Wiresaw Manufacturing Processes

4.8 Summary

References

Notes

5 Modeling of the Wiresaw Manufacturing Process and Material Characteristics

5.1 Introduction

5.2 The Rolling‐indenting Model

5.3 Vibration Modeling and Analysis

5.4 Damping Factor of the Slurry Wiresaw Systems

5.5 Elasto‐hydrodynamic Process Modeling

5.6 Thermal Management

5.7 Wire, Wire Web, and Slurry Management

5.8 Summary

References

Notes

6 Diamond‐Impregnated Wire Saws and the Sawing Process

6.1 Introduction

6.2 Manufacturing Processes of Diamond‐impregnated Wires

6.3 Slicing Mechanism of a Diamond Wire Saw

6.4 Properties of Wafers Sliced by Diamond Wire Saws

6.5 Slicing Performance with Different Process Parameters

6.6 Summary

References

Notes

Part III: Wafer Surface Preparation and Management

7 Lapping

7.1 Introduction

7.2 Fundamentals of Lapping and FAM

7.3 Various Configurations and Types of Lapping Operation

7.4 Lapping and Preliminary Planarization

7.5 Technical Challenges and Advances in Lapping

7.6 Summary

References

Notes

8 Chemical Mechanical Polishing

8.1 Introduction

8.2 Chemical Mechanical Polishing (CMP)

8.3 Polishing Pad Technology

8.4 Polishing Slurry Technology

8.5 Edge Polishing

8.6 Summary

References

Notes

9 Grinding, Edge Grinding, Etching, and Surface Cleaning

9.1 Introduction

9.2 Wafer Grinding for Surface Processing

9.3 Edge Grinding

9.4 Etching

9.5 Surface Cleaning

9.6 RCA Standard Clean

9.7 Summary

References

Notes

10 Wafer Metrology and Optical Techniques

10.1 Introduction

10.2 Evaluation and Inspection of the Wafer Surface

10.3 Wafer Defects and Inspection

10.4 Measurement of the Wafer Surface Using Moiré Optical Metrology

10.5 Summary

References

Notes

11 Conclusion

11.1 (I) From Crystal to Prime Wafers

11.2 (II) Wafer Forming

11.3 (III) Wafer Surface Preparation and Management

11.4 Final Remarks

Index

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