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(Ebook) Stress and Strain Engineering at Nanoscale in Semiconductor Devices by Chinmay K. Maiti ISBN 9780367519292, 0367519291

  • SKU: EBN-34389882
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Instant download (eBook) Stress and Strain Engineering at Nanoscale in Semiconductor Devices after payment.
Authors:Chinmay K. Maiti
Pages:260 pages.
Year:2021
Editon:1
Publisher:CRC Press
Language:english
File Size:37.69 MB
Format:pdf
ISBNS:9780367519292, 0367519291
Categories: Ebooks

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(Ebook) Stress and Strain Engineering at Nanoscale in Semiconductor Devices by Chinmay K. Maiti ISBN 9780367519292, 0367519291

Anticipating a limit to the continuous miniaturization (More-Moore), intense research efforts are being made to co-integrate various functionalities (More-than-Moore) in a single chip. Currently, strain engineering is the main technique used to enhance the performance of advanced semiconductor devices. Written from an engineering applications standpoint, this book encompasses broad areas of semiconductor devices involving the design, simulation, and analysis of Si, heterostructure silicongermanium (SiGe), and III-N compound semiconductor devices. The book provides the background and physical insight needed to understand the new and future developments in the technology CAD (TCAD) design at the nanoscale.
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