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(Ebook) Signal Integrity Characterization Techniques 2nd Edition by Mike Resso, Eric Bogatin ISBN 9781931695930 1931695938

  • SKU: EBN-43209352
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Authors:Mike Resso, Eric Bogatin [edited by]
Pages:762 pages.
Year:2009
Editon:2
Publisher:IEC
Language:english
File Size:9.11 MB
Format:pdf
ISBNS:9781931695930, 1931695938
Categories: Ebooks

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(Ebook) Signal Integrity Characterization Techniques 2nd Edition by Mike Resso, Eric Bogatin ISBN 9781931695930 1931695938

(Ebook) Signal Integrity Characterization Techniques 2nd Edition by Mike Resso, Eric Bogatin - Ebook PDF Instant Download/Delivery: 9781931695930 ,1931695938
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ISBN 10: 1931695938
ISBN 13: 9781931695930
Author: Mike Resso, Eric Bogatin

Cogently addressing the future of signal integrity and the effect it will have on the data-transmission industry as a whole, this all-inclusive guide addresses a wide array of technologies, from traditional, digital data transmission to microwave measurements, and accessibly examines the gap between the two. Focusing on real-world applications and providing a wide array of case studies that show how each technology can be used from backplane design challenges to advanced error correction techniques this guide addresses many of today’s high-speed technologies while also providing excellent insight into their future direction. With numerous valuable lessons pertaining to the signal integrity industry, this resource is the ultimate must-read guide for any specialist in the design engineering field.Contents Preface xviiAcknowledgements xxixPart I: Getting Started: Introducing TDR and VNA Techniques and the Power of S-Parameters 3Part II: Backplane Measurements and Analysis 239Part III: Assuring Quality Measurements: Probing and De-Embedding 303Part IV: Jitter and Active Signal Analysis 459Part V: Analysis of New Technologies 549Part VI: Future Technology Trends 651Author Biographies 749
Signal Integrity Characterization Techniques addresses the gap between the traditional digital and microwave measurement technologies while focusing on a practical and intuitive understanding of signal integrity effects within the data channel. High-speed interconnects such as connectors, PCB’s, cables IC packages and backplanes are critical elements of differential channels that must now be optimized using today’s most powerful analysis and characterization tools. Both measurements and simulation must be done on the device under test and must yield data that correlates with each other. Most of this book concentrates on real-world application of signal integrity measurements...from backplane design challenges to advanced error correction techniques to jitter measurement tools. The authors’ approach wisely address many of today’s high-speed technologies, provides excellent insight into itsfuture direction and will teach the reader valuable lessons pertaining to the signal integrity industry.

(Ebook) Signal Integrity Characterization Techniques 2nd Edition Table of contents:

Part I: Getting Started — Introducing TDR and VNA Techniques and the Power of S-Parameters

Chapter 1: Single-Port TDR, TDR/TDT, and 2-Port TDR Measurements
– 1.1 Introduction
– 1.2 Single-Port TDR
– 1.3 Two-Port TDR/TDT
– 1.4 Two-Port TDR/Crosstalk
– 1.5 Two-Port Differential TDR (DTDR)

Chapter 2: 4-Port TDR/VNA/PLTS Measurements
– 2.1 Introduction
– 2.2 Four-Port Techniques
– 2.3 Summary

Chapter 3: Differential Impedance Design and Verification with a TDR
– 3.1 Abstract
– 3.2 Overview

Chapter 4: Accuracies and Limitations of Time and Frequency Domain Analyses of Physical-Layer Devices
– 4.1 Introduction
– 4.2 Equipment Setup
– Coverage of TDR vs. VNA sources, calibration, errors, measurement accuracies, and comparisons

Chapter 5: Data Mining 12-Port S-Parameters
– 5.1 Abstract
– 5.2 High-Speed Serial Links and the Bandwidth of Interconnects
– 5.3 Four-Port S-Parameters
– 5.4 Twelve-Port S-Parameters and Information Overload
– 5.5 Serial-Link Performance Analysis
– 5.6 Losses
– 5.7 Impedance Continuities
– 5.8 Mode Conversion
– 5.9 Channel-to-Channel Crosstalk
– 5.10 Conclusion

Part II: Backplane Measurements and Analysis

Chapter 6: A Design of Experiments for Gigabit Serial Backplane Channels
– 6.1 Abstract
– 6.2 Introduction
– 6.3 Serial Backplane Channels
– 6.4 Backplane Platform Description
– 6.5 Daughtercard Description
– 6.6 Backplane Characterization
– 6.7 eHSD Connection Channels
– 6.8 HM-Zd Channels
– 6.9 HM-2mm Channels
– 6.10 Crosstalk Measurements
– 6.11 Eye Diagram Analysis
– 6.12 Reference Channels
– 6.13 Summary

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Tags: Mike Resso, Eric Bogatin, Signal Integrity, Characterization Techniques

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