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(Ebook) Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture (Woodhead Publishing Series in Electronic and Optical Materials) by Wong, E-H, Mai, Y.-W. ISBN 9781845695286, 1845695283

  • SKU: EBN-55613014
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4.4

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Instant download (eBook) Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture (Woodhead Publishing Series in Electronic and Optical Materials) after payment.
Authors:Wong, E-H, Mai, Y.-W.
Pages:482 pages.
Year:2015
Editon:1
Publisher:Woodhead Publishing
File Size:19.67 MB
Format:pdf
ISBNS:9781845695286, 1845695283
Categories: Ebooks

Product desciption

(Ebook) Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture (Woodhead Publishing Series in Electronic and Optical Materials) by Wong, E-H, Mai, Y.-W. ISBN 9781845695286, 1845695283

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.
*Free conversion of into popular formats such as PDF, DOCX, DOC, AZW, EPUB, and MOBI after payment.

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