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(Ebook) Microvias: For Low Cost, High Density Interconnects by John H. Lau, S.W. Ricky Lee ISBN 9780071363273, 0071363270

  • SKU: EBN-1130992
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5.0

41 reviews
Instant download (eBook) Microvias: For Low Cost, High Density Interconnects after payment.
Authors:John H. Lau, S.W. Ricky Lee
Pages:549 pages.
Year:2001
Editon:1
Publisher:McGraw-Hill Professional
Language:english
File Size:11.5 MB
Format:pdf
ISBNS:9780071363273, 0071363270
Categories: Ebooks

Product desciption

(Ebook) Microvias: For Low Cost, High Density Interconnects by John H. Lau, S.W. Ricky Lee ISBN 9780071363273, 0071363270

The first comprehensive and in-depth guide to microvia and wafer level chip scale package (WLCSP) technologies. This reference gives you cutting edge information on the most important developments and latest research results in applying the microvia and WLCSP technologies to low-cost and high-density interconnects. For professionals active in microvia and WLCSP research and development, those who wish to master microvia and WLCSP problem solving methods, and those demanding a cost-effective design and high-yield manufacturing process for their low-cost and high-density interconnect systems, here is up-to-the-minute coverage of all aspects of this fascinating field.
*Free conversion of into popular formats such as PDF, DOCX, DOC, AZW, EPUB, and MOBI after payment.

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