Most ebook files are in PDF format, so you can easily read them using various software such as Foxit Reader or directly on the Google Chrome browser.
Some ebook files are released by publishers in other formats such as .awz, .mobi, .epub, .fb2, etc. You may need to install specific software to read these formats on mobile/PC, such as Calibre.
Please read the tutorial at this link. https://ebooknice.com/page/post?id=faq
We offer FREE conversion to the popular formats you request; however, this may take some time. Therefore, right after payment, please email us, and we will try to provide the service as quickly as possible.
For some exceptional file formats or broken links (if any), please refrain from opening any disputes. Instead, email us first, and we will try to assist within a maximum of 6 hours.
EbookNice Team
Status:
Available4.4
41 reviews(Ebook) Area Array Packaging Handbook Manufacturing and Assembly 1st Edition by Ken Gilleo - Ebook PDF Instant Download/Delivery: 9780071374934 ,0071374930
Full download (Ebook) Area Array Packaging Handbook Manufacturing and Assembly 1st Edition after payment
Product details:
ISBN 10: 0071374930
ISBN 13: 9780071374934
Author: Ken Gilleo
(Ebook) Area Array Packaging Handbook Manufacturing and Assembly 1st Edition Table of contents:
Section 1: Packaging Concepts and Design
Introduction to Electronic Packaging
Electronics Industry Overview
Trends/Drivers in the Electronics Manufacturing Industry
Area Array Packaging
Stacked/3D Packages
Compliant IC Packaging
Flip Chip Technology
Options in High-Density Part Cleaning
MEMS Packaging and Assembly Challenges
Ceramic Ball and Column Grid Array Overview
Section 2: Materials
Polymer Packaging Materials: Adhesives, Encapsulants, and Underfills
Hermetic Packaging Systems: Adhesive and Getter
Area Array Solder Spheres, Pastes, and Fluxes
Modern Solder and Solder Paste
Lead-Free Systems and Process Implications
Electrically Conductive Adhesives for Surface-Mount and Flip Chip Processes: An Alternative to Solder?
Section 3: Equipment and Processes
Next-Generation Flip Chip Materials and Processes
Flip Chip Assembly and Underfilling
BGA and CSP Rework: What Is Involved?
BGA Assembly Reliability
Die Attach and Rework
Liquid Encapsulation Equipment and Processes
Molding for Area Array Packages
Screen Printing and Stenciling
Criteria for Placement and Processing of Advanced Packages
Ovens in Electronics
Process Development, Control, and Organization
Section 4: Economics and Productivity
Metrics: The Key to Productivity
Cost Estimating for Electronic Assembly
Section 5: Future
The Future of Electronic Packaging
The Future of SMT Process Equipment
People also search for (Ebook) Area Array Packaging Handbook Manufacturing and Assembly 1st Edition:
area wrapping
area packaging machine
x array
area array components
1a1 packaging
Tags: Ken Gilleo, Area Array Packaging, Manufacturing
4.6
12 reviews
4.7
9 reviews
5.0
29 reviews
4.8
31 reviews
4.5
29 reviews