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(Ebook) 3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility by Horng, Tzyy-sheng Jason; Hwang, Lih-Tyng ISBN 9781119289647, 9781119289661, 9781119289678, 1119289645, 1119289661, 111928967X

  • SKU: EBN-7034462
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Instant download (eBook) 3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility after payment.
Authors:Horng, Tzyy-sheng Jason; Hwang, Lih-Tyng
Pages:0 pages.
Year:2018
Editon:1st edition
Publisher:John Wiley & Sons
Language:english
File Size:11.96 MB
Format:pdf
ISBNS:9781119289647, 9781119289661, 9781119289678, 1119289645, 1119289661, 111928967X
Categories: Ebooks

Product desciption

(Ebook) 3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility by Horng, Tzyy-sheng Jason; Hwang, Lih-Tyng ISBN 9781119289647, 9781119289661, 9781119289678, 1119289645, 1119289661, 111928967X

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